SK Group Chairman Chey Tae-won has met with leaders of global tech giants, including Amazon and Intel Corp., to discuss ways to broaden business corporation in artificial intelligence (AI) semiconductors, his company said Monday. Chey, who has been on a U.S. trip since June 22, held talks with Amazon CEO Andy Jassy at the headquarters of the U.S. multinational technology company in Seattle, Washington, last week, to explore ways to enhance cooperation in the AI chip sector, according to SK Group. Amazon has unveiled its own AI chips, Trainium and Inferentia, as part of its plans to expand its business portfolio to include designing AI chips and offering AI services. The U.S. company is one of SK hynix's clients for high-bandwidth memory (HBM), a core component for AI semiconductors. SK hynix is leading the HBM market with its latest fifth-generation HBM3E product. Later, Chey also met with Intel CEO Pat Gelsinger at its headquarters in San Jose, California. During the meeting, the two leaders celebrated the long partnership between the two companies, and shared views on future technologies and business collaborations in the sector of AI chips. In partnership with Intel, SK hynix developed the fastest DRAM for servers, DDR5 Multiplexer Combined Ranks Dual In-line Memory Module, in December 2022. Last year, SK hynix's DDR5 product for servers received approval for Intel's fourth-generation processor for the first time in the industry. During his stay in the United States, Chey has also met with other tech moguls, including Sam Altman from OpenAI and Satya Nadella of Microsoft Corp. Meanwhile, SK Group unveiled its reform plan to secure 80 trillion won (US$58 billion) by 2026 to increase investment in AI and semiconductors, aiming to keep up with the AI-led industry transition. Source: Yonhap News Agency