Xilinx to be Featured in the 5G Forum at the 2014 International Mobile Internet Conference

BEIJING, Aug. 11, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced it will be featured in the 5G Forum at the upcoming 2014 International Mobile Internet Conference in China which will highlight innovations in the mobile internet era.  Sunil Kar, Vice President of the Wireless Communications Business Unit at Xilinx, will discuss how “Xilinx All Programmable Technology Enables Heterogeneous 5G Wireless Networks”.  To learn more, register for the 2014 International Mobile Internet Conference at the Beijing International Convention Center of China on August 14 -15, 2014.

Next-generation 5G systems offer the promise of higher throughput, lower latency, lower power and high reliability compared to current technology. This new technology will require new equipment types, a modified air interface and new frequency bands.

During the conference, attendees will learn how Xilinx’s smarter solutions for wireless networks will enable 5G requirements and overcome heterogeneous networking challenges. These solutions will provide equipment vendors the ability to shorten development time by leveraging the industry’s first All Programmable SoC and 20nm FPGA devices. The Xilinx® Zynq®-7000 and Kintex® UltraScale™ families provide unprecedented levels of performance, system integration and bandwidth to expedite the development, testing and deployment of early 5G systems. 

About Xilinx

Xilinx is the world’s leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.

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© Copyright 2014 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Vivado, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.

SMIC and JCET Establish a Joint Venture in Jiangyin National High-Tech Industrial Development Zone

SHANGHAI, Aug. 8, 2014 /PRNewswire/ — Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981) the largest and most advanced pure foundry provider in China; and Jiangsu Changjiang Electronics Technology Co., Ltd. (“JCET”, SSE: 600584), the largest packaging service provider in China, jointly announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.

By setting up in Jiangyin National High-Tech Industrial Development Zone, the joint venture can benefit from Jiangyin’s unique location and mature industrial environment to quickly set up the 12-inch wafer bumping and CP testing production line (Middle-End-Of-Line). Meanwhile, the joint venture can also utilize JCET’s nearby advanced back-end packaging production line, which includes Flip-Chip to support advanced Back-End-Of-Line production for 40/45nm, 28nm and below. Together with SMIC’s 12-inch front-end advanced chip production line in development, this will be China’s first-ever domestic 12-inch advanced IC manufacturing supply chain. This supply chain will shorten the overall manufacturing cycle time. More importantly, its close proximity to China’s consumer electronic industry and the world’s largest end-market, will allow our customers to respond with a shorter time-to-market window, and therefore better serve the fast changing consumer electronic market.

Dr. Tzu-Yin Chiu, SMIC’s Chief Executive Officer and Executive Director commented, “The Yangtze River Delta is regionally the strongest, largest, and most developed ecosystem in China’s IC industry. Jiangyin is located in the center of Yangtze River Delta’s ‘Golden Triangle’ comprised of Suzhou, Wuxi and Changzhou, and is only 180km from Shanghai. Furthermore, Jiangyin has good transportation infrastructure and is a hub of human talents. With our strategic partner JCET located in Jiangyin, our joint venture will rely on JCET’s existing manufacturing base and established facilities, thus, the mid and back-end lines will be constructed nearby to increase its dominance in the area, shorten its lead-time, and provide a one-stop service for customers. The initiation and implementation of the project will benefit SMIC’s ramp up of 28nm mass production and will help increase the capability of China’s semiconductor industry.”

Mr. Xinchao Wang, Chairman of JCET stated, “SMIC and JCET’s joint venture in Jiangyin will combine our companies’ strengths and enhance our long-term relationship; furthermore, the joint venture will focus on upgrading the domestic 3D IC industry chain to world-class standards.”

Jian Shen, Mayor of Jiangyin and Director of Jiangyin High-Tech Zone said, “SMIC and JCET are the most prominent companies in China’s semiconductor industry. The joint venture will help Jiangyin to become an important component of China’s most advanced semiconductor ecosystem. The Jiangyin municipal government gives its full support to this project in order to establish Jiangyin as one of the leading integrated circuit manufacturing bases, and to accelerate the growth and development of China’s semiconductor industry.”

About JCET

As a well-known semiconductor assembly and testing company and the chairman member of the strategic alliance of IC industrial chain technological innovation, Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) was established in 1972, with a registered capital of USD139 million , and total assets of USD1.3billion. In 2003, JCET is listed in the A-Share Section on Shanghai Stock Exchange, which is the first listed company in the semi-conductor assembly and testing industry in Mainland China. In 2012 JCET was ranked as NO.7 Company in the global semiconductor assembly and testing industry with a sales volume of 714 million USD (NO.1 in mainland China).

JCET enjoys more than 600 domestic and foreign patents, of which about 40% are invention patents, and took the lead into the TSV, RF-SiP and 3D-RDL, copper pillar bump, HD-FCBGA and 25um thickness chips stacking, MEMS, MIS and PoP – nine major fields of international IC technology and realized the mass production of the MIS, WL-CSP and SiP, CPB and flip-chip products.

About SMIC

Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services at 0.35-micron to 28-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab in Beijing and a majority owned 300mm fab for advance nodes under development; a 200mm fab in Tianjin; and a 200mm fab project under development in Shenzhen. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com.

Safe Harbor Statements

(Under the Private Securities Litigation Reform Act of 1995)

This document contains, in addition to historical information, “forward-looking statements” within the meaning of the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMIC’s current assumptions, expectations and projections about future events. SMIC uses words like “believe,” “anticipate,” “intend,” “estimate,” “expect,” “project” and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC’s senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC’s actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition, timely wafer acceptance by SMIC’s customers, timely introduction of new technologies, SMIC’s ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity, financial stability in end markets and intensive intellectual property litigation in high tech industry.

In addition to the information contained in this document, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with the SEC on April 14, 2014, especially in the “Risk Factors” section and such other documents that we may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this document may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the date of this document.

JCET Contact Information:
Zhu Zhengyi
Tel: +86-510-86851811
Email: zzy@cj-elec.com

SMIC Contact Information:
English Media
Michael Cheung
Tel: +86-21-3861-0000 x16812
Email: Michael_Cheung@smics.com

Chinese Media
Angela Miao
Tel: +86-21-3861-0000 x10088
Email: Angela_Miao@smics.com

Microchip Introduces the PIC32 Bluetooth(R) Starter Kit

BANGKOK, Aug. 7, 2014 /PRNewswire/ — Microchip Technology Inc. [NASDAQ: MCHP], a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, has announced the new PIC32 Bluetooth® Starter Kit. The full-featured kit boasts a PIC32 microcontroller (MCU), HCI-based Bluetooth radio, Cree high-output multi-color LED, 3 standard single-color LEDs, an analog 3-axis accelerometer, analog temperature sensor and 5 push buttons for user-defined inputs. Additionally, a PICkit™ On Board (PKOB) eliminates the need for an external debugger/programmer, USB connectivity and GPIOs for rapid development of Bluetooth Serial Port Profile (SPP), USB and general-purpose applications. The starter kit also features a plug-in interface for an audio CODEC daughter card which is set to release at a later stage to support Bluetooth audio.

Microchip PIC32 Bluetooth® Starter Kit

Microchip PIC32 Bluetooth® Starter Kit

The Bluetooth Starter Kit includes a PIC32MX270F256D MCU for main processing that runs at 83 DMIPS with 256 KB Flash and 64 KB RAM with a rich feature set including USB, I2S/SPI, mTouch® capacitive touch sensing and an 8-bit Parallel Master Port. The kit reduces software development time by offering a free Bluetooth SPP stack optimised for the on-board PIC32 MCU for setting up emulated serial port connections between two peer Bluetooth devices.

The Bluetooth Starter Kit is targeted for low-cost applications in the consumer markets, such as Bluetooth thermostats and wireless gaming controllers. In the medical and industrial markets, applications include blood glucose meters, wireless diagnostic tools, Bluetooth GPS receivers, Bluetooth serial adapters and cordless barcode scanners.

“Microchip’s new Bluetooth Starter Kit is an ideal solution for developers who want to add Bluetooth as a wire replacement for their designs in consumer, industrial, medical and gaming markets,” said Rod Drake, director of Microchip’s MCU32 Division. “The kit includes everything that a designer needs for rapid prototype and development of Bluetooth SPP designs.”

Development support

The PIC32 Bluetooth Starter Kit is supported by Microchip’s free MPLAB® X Integrated Development Environment (IDE) and MPLAB Harmony Integrated Software Framework. Additionally, the free Quick Start Package is available today, featuring an Android™ application development environment.  It also includes a free Software Development Kit (SDK) with the application source code and binary for  Microchip’s Bluetooth SPP library.  Both are optimised for the on-board PIC32 MCU, and are available today via freedownload under the Documentation and Software section at — http://www.microchip.com/get/1AVL .

Availability

The PIC32 Bluetooth Starter Kit (part # DM320018) is available for purchase today. 

For additional information, contact any Microchip sales representative or authorised worldwide distributor, or visit Microchip’s website at http://www.microchip.com/get/1AVL. To purchase products mentioned in this press release, go to microchipDIRECT or contact one of Microchip’s authorised distribution partners.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

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About Microchip Technology

Microchip Technology Inc. (NASDAQ:  MCHP) is a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at http://www.microchip.com/get/SUMD.

Note: The Microchip name and logo, MPLAB, mTouch, and PIC are registered trademarks of Microchip Technology Incorporated in the U.S.A., and other countries. PICkit is a trademark of Microchip Technology Inc. All other trademarks mentioned herein are the property of their respective companies.

For more information, please contact:

Daphne Yuen (Microchip):
+852-2943-5115
Email: daphne.yuen@microchip.com

Photo – http://photos.prnasia.com/prnh/20140721/8521404111

SMIC Reports 2014 Second Quarter Results

SHANGHAI, Aug. 6, 2014 /PRNewswire/ — Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) (“SMIC” or the “Company”), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended June 30, 2014.

Second Quarter 2014 Highlights

  • Revenue was $511.3 million in 2Q14, an increase of 13.4% quarter over quarter.
  • Non-GAAP revenue excluding wafer shipments from Wuhan Xinxin reached a record high of $511.3 million in 2Q14, an increase of 1.9% year over year compared to $501.8 million in 2Q13.
  • Gross margin was 28.0% in 2Q14, compared to 21.3% in 1Q14.
  • Profit for the period attributable to SMIC was $56.8 million in 2Q14, compared to $20.3 million in 1Q14.
  • China-region revenue grew to 44.4% of overall revenue becoming the largest contributor to revenue regionally in 2Q14.

Third Quarter 2014 Guidance:

The following statements are forward looking statements which are based on current expectations and which involve risks and uncertainties, some of which are set forth under “Safe Harbor Statements” below.

  • Revenue is expected to increase 1% to 5% quarter over quarter.
  • Gross margin is expected to range from 24% to 26%.

Non-GAAP operating expenses excluding the effect of employee bonus accrual, government funding and gain from the disposal of living quarters are expected to range from $96 million to $101 million.

Dr. Tzu-Yin Chiu, SMIC’s Chief Executive Officer and Executive Director, commented, “Excluding Wuhan‘s contribution, SMIC achieved record high revenue in the second quarter, which is our ninth consecutive profitable quarter. We reached a gross margin of 28%–our highest since 2005.

Compared to Q1 2014, utilization was up more than 10 percentage points; while revenue increased 13.4% sequentially. When comparing Q2 2014 to Q1 2014, gross margin increased 6.7 percentage points, profit from operations nearly doubled, and net profit tripled. We continue to emphasize the priority of sustained profitability and carefully planned growth. Overall, we are optimistic about 2015 as we prepare our capacity and technology for many new and exciting opportunities.

One of our growth drivers for 2015 will be 28nm. We are happy to work with our long-time customer as we ramp up this new technology. We are on track to have production ramp up in 2015. We are also working with other customers who are targeting to capture the LTE handset IC market in China, AP for tablets, and RF applications on 28nm.

Our other growth driver for this year and more so in 2015 is our differentiated product offering. SMIC continues to experience high demand for 8-inch production capacity for PMIC, CIS, e-NVM, and sensors. Our effort in 12-inch specialty process development has recently yielded the industry’s leading 55nm embedded NVM solution. Our customer has entered into high volume production based on this technology.

The strong IC demand in China is continuing to drive our growth. For the first time in SMIC’s history, our China revenue has exceeded all other regions in the second quarter. Revenue from China now accounts for more than 44% of our total revenue.

The second quarter recovery ended with strong financials and profitability for SMIC. We are optimistic about 2015 as we prepare for growth on 8-inch and 28nm. We continue to have confidence in our strategy to capture growth opportunities in China.”

Conference Call / Webcast Announcement

Date: August 7, 2014

Time: 8:30 a.m. Shanghai time

Dial-in numbers and pass code:

China

400-620-8038

(Pass code: SMIC)

Hong Kong

852-2475-0994

(Pass code: SMIC)

Taiwan

886-2-2650-7825

(Pass code: SMIC)

United States, New York

1-845-675-0437

(Pass code: SMIC)

The call will be webcast live with audio at http://www.smics.com/eng/investors/ir_presentations.php or http://www.media-server.com/m/p/89si7vqg.

An archived version of the webcast, along with an electronic copy of this news release will be available on the SMIC website for a period of 12 months following the webcast.

About SMIC

Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services at 0.35-micron to 28-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab in Beijing with a joint-venture 300mm fab that is currently under construction; a 200mm fab in Tianjin; and a 200mm fab project under development in Shenzhen. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong.

For more information, please visit www.smics.com .

Safe Harbor Statements

(Under the Private Securities Litigation Reform Act of 1995)

This press release contains, in addition to historical information, “forward-looking statements” within the meaning of the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements, including statements under “Third Quarter 2014 Guidance” and the statements regarding our optimism about our 2015 opportunities, our expected 2015 growth driver of 28nm technology, our expectation to have production ramp up in 2015, our expectation of differentiated products offering being another growth driver for this year and more so in 2015, our anticipation to experience high demand for 8-inch production capacity for PMIC, CIS, e-NVM, and sensors and our confidence in our strategy to capture growth opportunities in China, as well as the statements regarding future 2014 capital expenditures are based on SMIC’s current assumptions, expectations and projections about future events. SMIC uses words like “believe,” “anticipate,” “intend,” “estimate,” “expect,” “project,” “target” and similar expressions to identify forward-looking statements, although not all forward-looking statements contain these words. These forward-looking statements involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC’s actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with the global economic slowdown, orders or judgments from pending litigation and financial stability in end markets.

Investors should consider the information contained in SMIC’s filings with the U.S. Securities and Exchange Commission (SEC), including its annual report on 20-F filed with the SEC on April 14, 2014, especially the consolidated financial statements, and such other documents that SMIC may file with the SEC or The Hong Kong Stock Exchange Limited (“SEHK”) from time to time, including current reports on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on SMIC’s future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this press release may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated, or if no date is stated, as of the date of this press release. Except as may be required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise.

About Non-Generally Accepted Accounting Principles (“Non-GAAP”) Financial Measures

To supplement SMIC’s consolidated financial results presented in accordance with IFRS, SMIC uses in this press release measures of operating results that are adjusted to exclude wafer shipments from Wuhan Xinxin Semiconductor Manufacturing Corporation (“Wuhan Xinxin”), which SMIC began gradually phasing out in 3Q13. There were no wafer shipments from Wuhan Xinxin from 1Q14 onwards. This earnings release includes non-GAAP revenue, non-GAAP cost of sales, non-GAAP gross margin and non-GAAP operating expenses, which consists of total operating expenses as adjusted to exclude the effect ofemployee bonus accrual, government funding and gain from the disposal of living quarters. It also includes third quarter 2014 guidance for non-GAAP operating expenses. The presentation of non-GAAP financial measures is not intended to be considered in isolation or as a substitute for the financial information prepared and presented in accordance with IFRS.

SMIC believes that use of these non-GAAP financial measures facilitates investors’ and management’s comparisons to SMIC’s historical performance. The Company’s management regularly uses these non-GAAP financial measures to understand, manage and evaluate the Company’s business and make financial and operational decisions.

The accompanying table has more information and reconciliations of each non-GAAP financial measure to its most directly comparable GAAP financial measure. A reconciliation of non-GAAP guidance measures to corresponding GAAP measures is not available on a forward-looking basis.

For the full version of SMIC’s second quarter financial results, please see:
http://photos.prnasia.com/prnk/20140806/0861405533-a

Contact:

Investor Relations

+86-21-3861-0000 ext. 12804

ir@smics.com